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It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens
We can meet the diverse design needs of our customers.
The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.
4-layer rigid flex circuit board
Number of Layers: Four Layers Materials: FR4 + Polyimide + Copper Foil + Carbarelay Board Thickness: FR4: 0.8 +/- 0.1mm PI: 0.175mm Surface Treatment: Electroless Gold Plating Au 2µ", Ni 80µ" Copper Foil Thickness: 1/H~H/1 OZ Blind Holes: L1~L2 / L3~L4 Remark: Smartwatch
